Expertise on various Design tools
Expertise on Wide
variety of Processors
Expertise on bunch of
Bus Architectures
Analog, Connectivity
Memory Devices
Up to 20-layer impedance controlled PCB
HDI Designs with blind / buried vias Technology
Hybrid PCB stack-ups for cost optimization (FR4+ High speed PCB material)
12.5 Gigabit Interface & High-Speed Serial Interface Designs